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Samsung to Use TSMC Technology for Nvidia's Custom Memory Chips
Sentiment: NeutralHigh Priority
What Happened?
Samsung Electronics will utilize TSMC's 3-nanometre process to manufacture base dies for Nvidia's next-generation high-bandwidth memory chips. This collaboration marks Samsung's first engagement with TSMC in HBM production.
Key points
- Samsung will produce base dies for Nvidia's custom high-bandwidth memory chips using TSMC's technology.
- This is the first time Samsung collaborates with TSMC for HBM manufacturing.
- Nvidia has also involved SK Hynix and Micron Technology in this process.
- The NVHBM integrates Nvidia's custom memory controller into the base die.
- Samsung plans to keep its in-house production for standard HBM and custom products.
- Samsung is evaluating its foundry's capacity to produce NVHBM base dies if demand exceeds TSMC's capacity.
Key insights
- The partnership may lead to improved efficiency in memory chip production.
- This could strengthen Samsung's position in the semiconductor market.
- Nvidia's integration of its memory controller may standardize memory chip production across suppliers.
Why it matters
This collaboration could enhance Nvidia's memory chip production capabilities.
Entities
Samsung Electronics· CompanyTSMC· CompanyNvidia· CompanySK Hynix· CompanyMicron Technology· Company
Source
Business Standard
